JPH0445246Y2 - - Google Patents
Info
- Publication number
- JPH0445246Y2 JPH0445246Y2 JP16955787U JP16955787U JPH0445246Y2 JP H0445246 Y2 JPH0445246 Y2 JP H0445246Y2 JP 16955787 U JP16955787 U JP 16955787U JP 16955787 U JP16955787 U JP 16955787U JP H0445246 Y2 JPH0445246 Y2 JP H0445246Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode piece
- metal electrode
- semiconductor device
- metal
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 28
- 230000035882 stress Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16955787U JPH0445246Y2 (en]) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16955787U JPH0445246Y2 (en]) | 1987-11-05 | 1987-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0173933U JPH0173933U (en]) | 1989-05-18 |
| JPH0445246Y2 true JPH0445246Y2 (en]) | 1992-10-23 |
Family
ID=31459728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16955787U Expired JPH0445246Y2 (en]) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445246Y2 (en]) |
-
1987
- 1987-11-05 JP JP16955787U patent/JPH0445246Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0173933U (en]) | 1989-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0445246Y2 (en]) | ||
| US2751527A (en) | Semiconductor devices | |
| JPH0637401A (ja) | 光半導体容器 | |
| JPS5929001B2 (ja) | スイシヨウハツシンキノ セイゾウホウホウ | |
| US3184658A (en) | Semiconductor device and header combination | |
| US3161811A (en) | Semiconductor device mount | |
| JP2546178B2 (ja) | リードレスダイオード | |
| US3150297A (en) | Lead wire connection for semiconductor device | |
| JPS635255Y2 (en]) | ||
| JPS6120780Y2 (en]) | ||
| JPS6236287Y2 (en]) | ||
| US3460002A (en) | Semiconductor diode construction and mounting | |
| JPS6240404Y2 (en]) | ||
| JPS5855649Y2 (ja) | 半導体装置 | |
| JPS5822332Y2 (ja) | 圧電素子の保持バネ | |
| JPH01751A (ja) | パッケ−ジ封止装置 | |
| JPS6225899Y2 (en]) | ||
| JPS6031263Y2 (ja) | 金属キヤツプ封止形半導体装置 | |
| JP2543661Y2 (ja) | マイクロ波トランジスタ | |
| JPS6050339B2 (ja) | 半導体素子 | |
| JPS6321090Y2 (en]) | ||
| JPH0155577B2 (en]) | ||
| JPH0469818B2 (en]) | ||
| JPH01293006A (ja) | 圧電振動子 | |
| JPH04119964U (ja) | 真空端子 |